Determination of trace elements in ultrapure semiconductor grade sulfuric acid using the Agilent 8900 ICP-QQQ in MS/MS mode
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چکیده
In the semiconductor industry, it is extremely important to reduce contamination within the manufacturing process, as particle-, metallic-, or organic-based contaminants degrade the quality and reliability of the final device. Organic materials, such as photoresist polymer patterns, must be thoroughly removed from the surface of the silicon wafer following ion implantation; this cleaning step is performed using a piranha solution; a mixture of sulfuric acid (H2SO4) and hydrogen peroxide (H2O2). Ensuring a low level of metal impurities in these chemicals is vital to ensure that contamination of the wafer surface is avoided at this stage in the manufacturing process. Determination of trace elements in ultrapure semiconductor grade sulfuric acid using the Agilent 8900 ICP-QQQ in MS/MS mode
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